Instead of disposing of this biomass waste, the team processes it into a plastic-like material through an innovative process involving molding and air-drying, resulting in a small, approximately 0.5 cm thick plate with a density of 1.23 g/cm³, comparable to the density of conventional printed circuit boards (PCBs). Using direct ink writing or a standard etching process and manual soldering, the researchers were able to deposit electronic components directly onto the fungal plates.
That’s neat. Do we also have compostable components? If so, we could have fully compostable devices. :D
If you can compost the board you can recover the components / metals more easily … maybe?