Instead of disposing of this biomass waste, the team processes it into a plastic-like material through an innovative process involving molding and air-drying, resulting in a small, approximately 0.5 cm thick plate with a density of 1.23 g/cm³, comparable to the density of conventional printed circuit boards (PCBs). Using direct ink writing or a standard etching process and manual soldering, the researchers were able to deposit electronic components directly onto the fungal plates.